The LS² - systems are used for laser marking of silicon wafers in wafer level packaging. LS² allows marking of product logos, cell codes and fond sets for product identification and traceability.

The unique feature of LS² is the integrated quality control QualMark. It allows the control of quality during wafer marking as an online process control with fast response to production and it eliminates the additional post process production and optical inspection.

The Wafer marking System LS² is available in a fully automatic production compatible version with automatic cassette wafer handling. It can handle wafer sizes of 4, 6, 8 and 12 inch.

Additional a semiautomatic tool LS²-SM for low volume production, prototyping and development is available.

LS Laser Marker Specifications:

min. 10µs/pixel, can be increased in steps of 10µs

Accuracy and Repeatability in x/y-axis: Up to 5 µm

Pixel Diameter: 40 µm/pixel

Speed:

min. 10µs/pixel, can be increased in steps of 10µs

Accuracy and Repeatability in x/y-axis: Up to 5 µm

Pixel Diameter: 40 µm/pixel <span style="font-size: