PAC TECH opens Taiwan Application Center for Solder Balling and Solder Jetting Platform

During Semicon Taiwan 2012 Pac Tech will demo their new SB²-Jet for Solder Ball Attach and Repair. The modular system can place and laser reflow solder spheres down to 30µm on wafers and substrates.

The SB²-Jet is a flexible machine platform for automatic Solder Ball Rework with Ball Inspection and Ball Placement on a max. 500mm x 500mm platform. Flux dispense, Laser Reflow, Laser Jetting and Handling for Wafers, Substrates or Single Packages (Trays) are optional.

The machine is applied for:

      -       Rework and Reballing of Wafers
-       Rework and Reballing of PCB’s or molded package strips
-       Single Chips
-       3D-Packaging for MEMS like HGA, camera modules etc.
-       Fast prototyping and mass production

For more information visit the product experts at booth 405 or 1006 at Semicon Taiwan 2012, TWTC Nangand Hall in Taipei. Semicon Taiwan 2012 will be held September 5-7, 2012.

SB² - Jet