Equipment
Wafer Level Packaging
Chemistry
Equipment
Wafer Level Packaging
Chemistry

Press Releases | News

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JPCA Show

JPCA Show

2016 Jun 01 - 03; Tokyo International Exhibition Center, Tokyo Big Sight, Tokyo, Japan; Booth 3E-20; www.JPCA.com

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ECTC

ECTC

2016 May 31 - Jun 03; The Cosmopolitan of Las Vegas, Las Vegas, NV, USA;Booth 404; www.ECTC.net

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Newsletter

 

Equipment Manufacturing

Equipment Manufacturing


PacTech is a leading supplier of Advanced Packaging Equipment with more than eighteen years of engineering experience. Our state-of-the-art automated equipment meets high quality standards and is suitable for various applications. Read more

 
Wafer Level Packaging Services

Wafer Level Packaging Services


PacTech is a worldwide leader in Wafer Level Bumping & Packaging Services. These services meet the high quality demands of our customers and support both engineering and prototyping services as well as high volume production. Read more

 
Chemistry

Chemistry


In cooperation with our partners we develop high-tech-chemicals for applications which are adapted to our processes. Our product portfolio includes concentrates and baths ready to use. Read more